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Edward T Pokriefka

from Farmington Hills, MI
Age ~66

Edward Pokriefka Phones & Addresses

  • 28377 Kirkside Ln, Farmington Hills, MI 48334

Publications

Us Patents

Flexible Circuit Board Interconnect With Strain Relief

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US Patent:
59171499, Jun 29, 1999
Filed:
May 15, 1997
Appl. No.:
8/856713
Inventors:
Tina Barcley - Rochester Hills MI
Norman J. Roth - Murfreesboro TN
Vasil Germanski - Washington MI
Edward T. Pokriefka - Farmington Hills MI
Robert A. Isola - Royal Oak MI
Assignee:
DaimlerChrysler Corporation - Auburn Hills MI
International Classification:
H05K 900
US Classification:
174 35C
Abstract:
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.

Flexible Circuit Board Interconnect With Strain Relief

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US Patent:
59818700, Nov 9, 1999
Filed:
May 15, 1997
Appl. No.:
8/857121
Inventors:
Tina Barcley - Rochester Hills MI
Robert A. Isola - Royal Oak MI
Edward T. Pokriefka - Farmington Hills MI
Norman J. Roth - Murfreesboro TN
Vasil Germanski - Washington MI
Assignee:
Chrysler Corporation - Auburn Hills MI
International Classification:
H05K 900
US Classification:
174 35C
Abstract:
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.

Flexible Circuit Board Interconnect With Strain Relief

View page
US Patent:
59248734, Jul 20, 1999
Filed:
May 15, 1997
Appl. No.:
8/857122
Inventors:
Tina Barcley - Rochester Hills MI
Robert A. Isola - Royal Oak MI
Edward T. Pokriefka - Farmington Hills MI
Norman J. Roth - Murfreesboro TN
Vasil Germanski - Washington MI
Assignee:
Chrysler Corporation - Auburn Hills MI
International Classification:
H02R 909
US Classification:
439 67
Abstract:
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.
Edward T Pokriefka from Farmington Hills, MI, age ~66 Get Report