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Mahesh Chengalva Phones & Addresses

  • Bothell, WA
  • 860 W Laredo Ave, Gilbert, AZ 85233 (765) 453-0914
  • 407 Rainbow Cir, Kokomo, IN 46902 (765) 453-0914
  • 3007 Matthew Dr, Kokomo, IN 46902 (765) 453-7962 (765) 293-9278
  • 3106 Matthew Dr, Kokomo, IN 46902 (765) 293-9278 (765) 453-0914
  • 2084 Neil Ave #18, Columbus, OH 43210 (614) 293-9278
  • 7707 NE 148Th Pl, Kenmore, WA 98028 (765) 418-1152

Work

Position: Craftsman/Blue Collar

Education

Degree: High school graduate or higher

Publications

Us Patents

Method Of Extending Life Expectancy Of Surface Mount Components

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US Patent:
6445589, Sep 3, 2002
Filed:
Jul 29, 1999
Appl. No.:
09/354755
Inventors:
Mahesh K. Chengalva - Kokomo IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 702
US Classification:
361760, 763765, 763770, 22818021, 22818022, 174255, 174260
Abstract:
A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height. The relationship between the stand-off height and the life expectancy of the component is directly proportional. A larger stand-off height translates into a longer life expectancy. The stand-off height is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height is set to a predetermined dimension by way of a spacer positioned between the surface mount component and the printed circuit board.

Filter Insert For An Electrical Connector Assembly

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US Patent:
6808422, Oct 26, 2004
Filed:
Mar 19, 2003
Appl. No.:
10/391905
Inventors:
Mahesh K. Chengalva - Kokomo IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01R 1200
US Classification:
439620, 439 67, 439 77
Abstract:
A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.

Filter Insert For An Electrical Connector Assembly

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US Patent:
20050085101, Apr 21, 2005
Filed:
Oct 22, 2004
Appl. No.:
10/971847
Inventors:
Mahesh Chengalva - Kokomo IN, US
International Classification:
H05K001/00
H01R012/00
US Classification:
439062000, 439059000
Abstract:
A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.

Surface Mounting Of Components

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US Patent:
20050163966, Jul 28, 2005
Filed:
Jan 23, 2004
Appl. No.:
10/763833
Inventors:
Mahesh Chengalva - Kokomo IN, US
Suresh Chengalva - Kokomo IN, US
Rick Snyder - Kokomo IN, US
International Classification:
B32B003/10
US Classification:
428131000
Abstract:
Surface mounting of components includes providing a substrate that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer that is patterned. A compliant layer is introduced to the first surface of the substrate and to the conductive layer. At least one aperture is formed in the compliant layer which extends to the surface of the conductive layer. Conductive material is introduced into the aperture(s). Solder couples the surface mount component to the compliant layer.

Method Of Forming A Composite Standoff On A Circuit Board

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US Patent:
20070119911, May 31, 2007
Filed:
Nov 28, 2005
Appl. No.:
11/287962
Inventors:
Su Chan - Singapore, SG
Binghua Pan - Singapore, SG
Cheng Cheok - Singapore, SG
Chih Nah - Singapore, SG
Robert Schofield - Cheshire, GB
Mahesh Chengalva - Kokomo IN, US
International Classification:
B23K 31/00
B23K 31/02
US Classification:
228180220
Abstract:
A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.

Heads Up Display

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US Patent:
20090231720, Sep 17, 2009
Filed:
Mar 12, 2008
Appl. No.:
12/075546
Inventors:
Mahesh K. Chengalva - Kokomo IN, US
International Classification:
G02B 27/14
US Classification:
359630
Abstract:
A heads up display apparatus for a vehicle having a windshield includes an LED display having alphanumeric characters which are at least reflected off of the vehicle windshield toward the driver. The display has power controls and, optionally, a variable brightness control through a manually driver manipulatable control member or automatically through an ambient light sensor output coupled to the display. A vehicle operating parameter output is coupled to the display and converted by the display into illuminated alphanumeric characters. Each element of each LED character includes a reflected element image and at least a partially refracted and reflected ghost element image which have juxtaposed and overlapped element to form a combined single image to the viewer.

Unmanned Multi-Purpose Ground Vehicle With Different Levels Of Control

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US Patent:
20110144828, Jun 16, 2011
Filed:
Dec 11, 2009
Appl. No.:
12/635953
Inventors:
Mahesh K. Chengalva - Gilbert AZ, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
G05D 1/00
G06F 19/00
US Classification:
701 2, 701 1, 701 23, 701 25
Abstract:
A vehicle comprises a platform, a propulsion system, a communications system, a sensor system, and a computer system. The propulsion system, communications system, sensor system, and computer system are associated with the platform. The propulsion system is configured to move the platform on a ground. The communications system is configured to establish a wireless communications link to a remote location. The sensor system is configured to generate sensor data. The computer system is configured to run a number of control processes to perform a mission and configured to perform operations in response to a number of commands from the number of operators if the number of requests is valid.

Low Cost Clearance Gauge And Method Of Using Same

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US Patent:
59258284, Jul 20, 1999
Filed:
Oct 8, 1997
Appl. No.:
8/946932
Inventors:
Mahesh K. Chengalva - Kokomo IN
Assignee:
Delco Electronics Corp. - Kokomo IN
International Classification:
G01N 300
US Classification:
73821
Abstract:
A clearance gauge comprises a thin foil rolled into a tubular coil at one end and having a flat tab extending from the coil, the coil windings being secured by a layer of adhesive. The gauge is attached via the tab to one of a pair of relatively movable parts and is deformed by compression between the parts to assume a dimension equal to the clearance between the parts. The foil has a low yield strength so that the coil substantially retains the dimension for later measurement to thereby afford a measure of the clearance.
Mahesh K Chengalva from Bothell, WA, age ~56 Get Report